Full Automatic BGA Rework Station

 

The fully automated BGA rework station has the following main functional features:

Heating System: Includes upper hot air heating, lower hot air heating, and bottom infrared preheating. The upper hot air heating is integrated with the mounting head, while the height of the lower hot air heating nozzle is adjustable to ensure uniform and stable heating. The bottom infrared preheater uses gold-plated infrared lamps and high-temperature-resistant quartz glass, providing rapid and even heating.

Solder Removal Function: The solder removal nozzle automatically removes solder, placing the chip in the designated position for attachment and soldering. The suction nozzle then automatically picks up the chip for placement and soldering, requiring no manual operation.

Optical Vision System: Equipped with a high-definition color optical system, featuring dual-color light splitting, wireless remote zoom, auto-focus, and software control, ensuring precision in soldering alignment.

 

 

1.Product Features of Hot Air Full Automatic BGA Rework Station

 

•High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.

• Convenient alignment.

•Three independent temperature heatings + PID self setting adjusted, temperature accuracy will be on ±1°C

•Built in vacuum pump, pick up and place BGA chips.

•Automatic cooling functions.

 

DH-G620 is totally same as DH-A2, automatically desoldering, pick-up, puting back and soldering for a chip, with optical alignment for mounting,no matter whether you have experience or not, you can master it in one hour.

2.Specification of Infrared Full Automatic BGA Rework Station

power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W.Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

3.Why Choose Our CCD Camera Full Automatic BGA Rework Station?

 

5.Certificate of Full Automatic BGA Rework Station Split Vision

 

4.Packing list of Full Automatic BGA Rework Station

 

5. Shipment of Full Automatic BGA Rework Station

We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe. If you prefer other terms of shipment, please feel free to tell us.

 

6. Payment terms.

Bank transfer, Western Union, Credit card.

We will send the machine with 5-10 business after receiving payment.

7. Related Knowledge

How to Debug a Newly Designed PCB Board

The following tips and methods are based on experience and are worth learning. When designing a PCB, besides skillfully using drawing software, you need solid theoretical knowledge and hands-on experience. These can help you complete your PCB design quickly and efficiently. However, it's also crucial to be meticulous; whether in wiring or layout, every step requires care. A small mistake can lead to a non-functional final product. Therefore, it's worth taking extra time to check details carefully rather than rushing through the design process. Overall, PCB design emphasizes attention to detail.

For PCB designers, debugging is often necessary, especially for newly designed boards. These can be challenging to troubleshoot, particularly when the board is large, and the components are complex. However, having a logical debugging approach can make the process more efficient.

For a new PCB board, begin by inspecting it for obvious issues such as cracks, short circuits, or open circuits. If necessary, check that the resistance between the power supply and ground is sufficient.

Next, proceed with component installation. For independent modules, avoid installing everything at once if you are unsure they are functioning correctly. Instead, install parts incrementally (for smaller circuits, you may install them all at once), allowing for easier fault isolation. Typically, start with the power supply module and check if the output voltage is normal. When powering on for the first time, consider using a current-limited adjustable power supply. Set the overcurrent protection, then gradually increase the voltage while monitoring the input current, input voltage, and output voltage. If there is no overcurrent and the output voltage is correct, the power supply is likely working properly. Otherwise, disconnect the power and troubleshoot.

Continue by installing other modules incrementally, powering on and checking each module to prevent overcurrent or component burnout due to design or installation errors.

Methods for Identifying Faults:

1,Voltage Measurement Method

• Start by confirming that the power supply voltage at each chip pin is correct. Check whether reference voltages are as expected and that working voltages at each point are within normal ranges. For example, for a typical silicon transistor, the BE junction voltage is about 0.7V, and the CE junction voltage is about 0.3V or less. If a transistor's BE junction voltage exceeds 0.7V (except in special cases like a Darlington transistor), the BE junction may be open.

2,Signal Injection Method

• Inject a signal at the input and measure the waveform at each point to identify fault locations. A simpler technique may involve touching the input of each stage with your finger to observe output reactions, which can be useful for audio and video amplifiers. (Note: This should not be done with high-voltage circuits or those with a hot backplane, as it may cause electric shock.) If there is no reaction at the previous stage but there is a reaction at the next, the problem likely lies at the previous stage.

3,Additional Fault Detection Techniques

Other techniques include visual inspection, listening, smelling, and touching:

• Look for physical damage, such as cracks, blackening, or deformation.
• Listen for unusual sounds, as something that should operate quietly may indicate an issue if it produces noise or if expected sounds are absent or abnormal.
• Smell for signs of overheating, such as burning odors or the scent of capacitor electrolyte, which an experienced technician can often detect.
• Touch to check if components are at normal operating temperatures, as some power components generate heat when active. If they are cold, they may not be working. Similarly, if a component is excessively hot, it may indicate malfunction. A general rule is that power transistors and voltage regulators should operate under 70°C, which you can check by holding your hand near them briefly (test carefully to avoid burns).

Debugging a newly designed circuit board can be challenging, especially with large or complex designs. But with a structured approach and attention to detail, the process can be manageable.