Bga Rework Tools

When a single failed BGA threatens a high-value assembly, you need more than a repair-you need guaranteed recovery. Our industrial BGA Rework Station isn't just equipment; it's your insurance policy against costly scrap and downtime, engineered to deliver flawless, repeatable results on the most demanding PCBs.

 

 

 

 

 

1.The Precision Salvage Tool：Our micro-alignment vision system and stabilized platform let you remove and replace 0.25mm pitch BGAs with confidence, saving thousands in component and board costs. --- fully automatic bga rework station

 

2.Multi-zone controllable temperature profile：Programmable, multi-zone thermal profiles apply the exact same heat to every board, ensuring every rework meets the same standard as your first-run production-critical for automotive. --- bga ic rework station

 

3.Closed-Loop Control System：This prevents board warping and damage. --- best bga rework station

 

Total power	11500W
Top heater	1200W
Lower heater	1200W
Bottom heater	9000W (German heating element, heating area 860×635)
Power supply	AC380V±10％ 50/60Hz
Dimensions	L1460×W1550×H1850 mm
Operation mode	Automated desoldering, soldering, suction, and placement in one integrated system.
Temperature profile storage	50,000 sets
Optical CCD lens	It extends and retracts automatically, and can be freely moved forward, backward, left, and right via a joystick, eliminating the problem of "blind spots" during observation.
Positioning	V-shaped card slot, PCB support bracket is adjustable in the X direction and comes with a universal clamp.
BGA position	Laser positioning allows for quick identification of the vertical points of the upper and lower temperature zones and the center of the BGA.
Temperature control	K-type thermocouple (K Sensor) , Closed-loop control
Temp accuracy	±3 degrees
Repeatable placement accuracy	+/-0.01mm
PCB size	Max 900×790 mm Min 22×22 mm
BGA chip	2×2-80×80mm
Minimum chip spacing	0.25mm
External Temperature Sensor	5
Net weight	820kg

 

 

 

 

 

1.Increased preheating area, capable of repairing large-size motherboards with dimensions of 900×790 MM;

2.The upper and lower temperature zones move freely synchronously, making repair more convenient;

3.Optical alignment ensures precise positioning for chip mounting, completely avoiding misalignment and deviation;

4.Automatic picking & removal, automatic welding, and automatic chip recycling fully liberate workers; (bga ic rework station)

5.The preheating zone adopts infrared light-emitting tubes, featuring fast heating, stable constant temperature, environmental protection, energy saving, and an attractive appearance;

6.Touch screen operation with pre-built programs allows proficient use without special technical training, making chip repair extremely simple;

7.External USB port for software updates/upgrades and importing various repair data into computers for analysis and storage;

8.Automatic scanning after repair completion to ensure repair quality, it's the best bga rework station for enterprise;

9.Suitable for repairing various SMT components {SOP, SOJ, QFP, QFN, BGA, PLCC, SCP……};

10.Optional function to connect to the MAS system. 

 

 

Prove It on Your Board: Skeptical? We get it. Request a live, online demonstration. Ship us a sample board with a known BGA failure. We'll conduct a live rework procedure via video link, showing you the entire process and the final, functional result.