IR Touch Screen BGA Rework Machine

IR touch screen bga rework machine Quick preview:

DH-A1L SMD REWORK MACHINE is eqiupped with laser positioning function, can quickly Position on BGA Chip

and motherboard.If you are looking for a bga rework station for mobile phone repairing, congratulation! You’ve find

the original factory. Dinghua, may be the best brand of bga rework station around the world.

 

1. Specification

 

Specification
1	Power	4900W
2	Top heater	Hot air 800W
3	Bottom heater Iron heater	Hot air 1200W, Infrared 2800W 90w
4	Power supply	AC220V±10%50/60Hz
5	Dimension	640*730*580mm
6	Positioning	V-groove, PCB support can be adjusted in any direction with external universal fixture
7	Temperature control	K type thermocouple, closed loop control, independent heating
8	Temp accuracy	±2 degrees
9	PCB size	Max 500*400 mm Min 22*22 mm
10	BGA chip	2*2-80*80mm
11	Minimum chip spacing	0.15mm
12	External Temperature Sensor	1(optional)
13	Net weight	45kg

 

2.Application of the DH-A1L BGA rework station

Application Use for BGA Rework Stations

BGA rework stations have several different applications in the world of PCB repair and alteration. Here are a few of

the most common applications.

Upgrades: Upgrades are one of the most common reasons for rework. Technicians may need to swap out parts or add

upgraded pieces to a PCB.

Faulty parts: PCBs can have various faulty parts that may require rework. For example, pads could get damaged during

BGA removal, any number of parts could be heat-damaged or there could be too much solder joint voiding.

Faulty assembly: A range of mistakes can occur during the rework process. For example, the PCB may have incorrect

BGA orientation or a poorly developed BGA rework thermal profile. If this is the case, the PCB will likely need to undergo

further rework to address the faulty assembly.

 

3.Why you should choose DH-A1L BGA rework station?

 

 

4. Related Knowledge：

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA

packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection

pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of

just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance

at high speeds.

 

Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable

for socket mounting.

5.Detailed Images of DH-A1L BGA REWORK STATION

 

 

6.Packing & delivery details of DH-A1L BGA REWORK STATION

 

 

 

Delivery detials of DH-A1L BGA REWORK STATION

Shipping:

1.Shipment will be done within 5 business days after receiving payment.

2.Fast delivery shipment by DHL,FedEX,TNT ,UPS and other ways including by sea or by air.

 

 

 

8.Similar item

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laptop notebook BGA chipset repairing system

smart phone chipset BGA repair soldering system

BGA repair soldering machine

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BGA repairing station

BGA de-soldering station

 

 

9. Notes

As we all know by now, the Playstation 3 (PS3) can suffer from the dreaded Yellow Light of Death (YLOD) and the Xbox 360 can be inflicted with the issue

called the Red Ring of Death (RROD). This occurs due to a manufacturer's defect when creating the board and not accounting for the vast amounts of heat

generated while playing with the system for long periods of time.

Due to heat stressing the GPU (Graphics chip that controls all the fancy visuals in your game), the solder that forms a connection between the chip and the

board eventually break. With this break, your system will throw that dreaded Blinking Light of Death error.Reball Method Repair - A reball repair is the same

procedure as the reflow, but with a few more steps involved. Instead of just heating the chip and letting the solder underneath melt, the chip is heated to the

point where it can be taken off the board.

Now when the chip is removed, there is about 200+ tiny solder points that have to be cleaned off with a soldering iron. Oh, and not to mention that you must

clean the board as it also contains 200+ solder points left over from the residue. After all that is cleaned, you have to now align 200+ tiny solder balls onto the

chip with a special stencil and mount. Saying it is easy, but doing it is not. This alone is the most annoying and time consuming part of a reball as you pour mass

amounts of balls onto a stencil in hopes that each of those 200+ balls are seated properly on the chip. After doing that, you have to remove the stencil and there

will always be a few balls being knocked out of place that you have to look for.

Once that is done, the chip alone has to be heated to the point where the 200+ balls melt onto the chip and stay there. After that you wait for it to cool. Then, you

place it back onto the board and reheat that to melt the chip onto the motherboard. And now you have a reballed system! Sometimes it could be very frustrating if

even one ball was misaligned.