3 Heating Zones Touch Screen Bga Reballing Station

 3 Heating Zones Touch Screen BGA Reballing Station

The purpose of the BGA rework station is to desolder, mount, and solder BGA chips on devices such as laptops, Xbox 360, computer motherboards, PS3, and more.

The DH-5830 is a very popular machine worldwide, known for its elegant appearance, affordable price, and simple user interface. It is especially favored by personal repair shops, regional distributors, and amateurs.

BGA rework stations typically come in two models:

1.Basic Model (Manual)

This model consists of hot air and infrared heaters, with either 2 or 3 heating zones. It features top and bottom hot air heaters (some models may not have a bottom hot air heater) and a third infrared heater.

2.High-End Model (Automatic)

This model includes an optical alignment vision system (optical CCD camera and monitor screen), allowing for clear observation of all the BGA chip points. The system ensures precise alignment of the BGA chip with the motherboard on the monitor screen, facilitating accurate soldering.

 

The product parameter of 3 heating zones touch screen bga reballing station

 

Total Power	4800W
Top heater	800W
Bottom heater	2nd 1200W, 3rd IR heater 2800W
Power	110~240V±10％50/60Hz
Lighting	Taiwan led working light, any angle adjusted.
Operation mode	HD touch screen, intelligent conversational interface, digital system setting
Storage	50000 groups
Top heater movement	Right/left, frontward/backward, rotate freely.
Positioning	Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groov PCB bracket + universal fixtures.
Power switch	Air switch (which can make machine and human being protected)
Temperature control	K sensor, close loop
Temp accuracy	±2℃
PCB size	Max 390×410 mm Min 22×22 mm
BGA chip	2x2 - 80x80 mm
Minimum chip spacing	0.15mm
External temper sensor	1pc
Dimensions	570*610*570mm
Net weight	33KG

  

The product details of 3 heating zones touch screen BGA reballing station

 

Two pairs of knobs for the top head moved, helpful and easily. Ahead pair of knob for top head moved up or

 down when soldering or desoldering , the rear pair of knobs for top for top head move rearward or forward 

for a proper position to solder.

 

 

 

"7" word shape, which can let the top head move leftward/ rightward or fixed.

 

 

Large IR preheating area (up to 370*420mm), most of PCB can be preheated by it, such as , computer, 

top set box and iPad etc. Power about 2800W, suited for 110~240V.

 

BGA rework station's operation interface, simple and easily operation, one LED light switch, one thermocouple port and one "start", when all of parameters are set in the touch screen , click "srart" to start soldering or desoldering.

 

About our factory

 

 

Our factory for BGA rework station, Auto screw locking machine and Auto soldering station manufacturing, 

occuping more than 3000 square meters, and continue expanding.

 

  

 

Part of workshop for BGA rework station, Auto screw locking manufacturing

 

 

CNC machining workshop for the spare parts of BGA rework station manufacturing

 

Our office

 

Delivery and Shipping Service for the 3 Heating Zones Touch Screen BGA Reballing Station

Details of the ordered machine will be confirmed with customers before manufacturing. Some accessories may be required for personal use (end-user), and we will inform customers about them before delivery.

We offer free training for all customers, whether they are distributors, resellers, end-users, or require after-sales service.

FAQ for the 3 Heating Zones Touch Screen BGA Reballing Station

Q: How many engineers are involved in researching and developing the BGA rework station?

A: There are 10 engineers dedicated to the BGA rework station. However, we also have other engineers working on machines such as the Automatic Screw Locking Machine and Auto Soldering Station.

Q: What is your warranty period?

A: For end-users, the warranty period is 1 year. For distributors, it is 2 years. However, these heaters now come with a 3-year warranty, regardless of who you are.

Q: Which express delivery services can I choose?

A: You can choose from DHL, TNT, FedEx, SF Express, and most special delivery lines.

Q: Which countries do you not yet sell to?

A: We sell to all countries, including those you may not be familiar with, such as Fiji, Brunei, and Mauritius.

Know-how about BGA Rework Station:

(BGA Packaging Technology)

BGA (Ball Grid Array) is a ball-shaped pin grid array packaging technology, a high-density surface mount packaging technology. The pins are spherical and arranged in a grid-like pattern at the bottom of the package, hence the name "Ball Grid Array." This technology is commonly used for motherboard control chipsets, and the material is typically ceramic.

With BGA-encapsulated memory, the memory capacity can be increased by two to three times without changing the memory size. Compared to TSOP (Thin Small Outline Package), BGA has a smaller size, better heat dissipation performance, and superior electrical performance. The BGA packaging technology has greatly increased the storage capacity per square inch. Memory products using BGA technology offer the same capacity as TSOP but are only one-third of the size.

Compared with the traditional TSOP packaging method, the BGA packaging method provides faster and more effective heat dissipation.

With the advancement of technology in the 1990s, chip integration levels increased, resulting in more I/O pins and higher power consumption. As a result, the requirements for integrated circuit packaging became more stringent. To meet these needs, BGA packaging began to be applied in production. BGA stands for "Ball Grid Array," referring to this type of packaging technology.