BGA Reballing Machine 110v

Automatic BGA Reballing Machine 110v

 

Model: DH-A2E

1.Product Features of Hot air Automatic BGA Reballing Machine 110v

 

• High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.
• Convenient alignment.
• Three independent temperature heatings + PID self setting adjusted, temperature  accuracy will be on ±1°C
• Built in vacuum pump, pick up and place BGA chips.
• Automatic cooling functions.

2.Specification of Hot air Automated BGA Reballing Machine 110v

Power	5300w
Top heater	Hot air 1200w
Bottom heater	Hot air 1200W. Infrared 2700w
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	Ktype thermocouple,closed loop control,independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm, Min 22 *22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGA chip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

3.Details of Infrared Automatic BGA Reballing Machine 110v

 

 

4.Why Choose Our Automatic BGA Reballing Machine 110v?

 

5.Certificate of Optical alignment automatic BGA Reballing Machine 110v

 

6.Packing list of Optics align CCD Camera BGA Reballing Machine 110v

 

7. Shipment of Automatic BGA Reballing Machine 110v Split Vision

We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe.  If you prefer other terms of shipment, please feel free to tell us.

 

8. Contact us for an instant reply and the best price.

Email: john@dh-kc.com

MOB/WhatsApp/Wechat:  +8615768114827

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https://api.whatsapp.com/send?phone=8615768114827

 

9. Related Knowledge of the Automatic BGA Reballing Machine (110V)

Test Procedure

The test procedure must account for both the tester and the test platform constraints. In the production planning schedule, the availability of resources for the testers needs to be considered, and different products correspond to different test platforms.

Since the test cycle is long, it is necessary to split the order according to daily capacity, complete the subsequent test-aging process in batches, and store the results in batches.

Aging Process

The aging process is the final step for the PCBA in the production cycle. Each order must be aged using the corresponding resources in the appropriate aging room. The aging methods for different products are generally the same, and the aging times are similar. During the aging process, new products can also be aged in the same room. Taking the A-aging device as an example, the aging room's resources and the corresponding sub-frames and slots are assigned based on the product.

Wave Soldering Process

Wave soldering involves melting solder (usually a lead-tin alloy) with an electric or electromagnetic pump to create a solder peak as required by the design. Alternatively, nitrogen can be injected into the solder pool to pre-load components. The printed circuit board (PCB) then passes through the solder peaks to solder the mechanical and electrical connections between the component leads and the PCB pads.

The carrier for the wave soldering process is a special mold, and each product requires a mold based on its layout. Due to the high manufacturing cost of the molds, it is not feasible to produce enough molds considering the order's cost constraints. Furthermore, most molds are not universal; molds for the same product are usually specific. Therefore, mixed-flow production is required in wave soldering: a variety of products can be produced on the same production line.

If products are to be produced in a mixed flow, the following conditions must be met:

• Process characteristics, such as temperature, must be consistent.
• The mold width must be the same.
• The limited number of molds must be considered when planning for mixed flow.
• Some special products cannot be produced in mixed flow.

In mixed-flow production, the cycle time depends on the number of molds in use, which is a non-fixed value and must be calculated dynamically.

When planning a production schedule, the following factors should be considered:

• Mixed-flow production: Orders that can be mixed on the same day should be processed together to maximize efficiency.
• Dynamic work time calculation: Due to mold limitations, the manufacturing time for an order cannot be calculated using a simple pass time.
• Minimizing outsourcing: To ensure timely delivery, prioritize internal system production over outsourcing wherever possible.
• Resource balance: Prioritize fast line production and ensure the production line remains balanced.
• Process connection: Ensure that orders from previous SMT production processes go directly to wave soldering to reduce waiting times.

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